The results from encapsulation peel tests, die and encapsulant pull tests, bonding wire pull tests and C-Mode SAM ( C-SAM ) examination are presented. This paper demonstrates that the optimized plasma cleaning process would enhance PBGA package qualification level and improve the process yields and productivity. 陈述了密封剥离试验、芯片和密封剂拉力试验、焊线拉力试验和C-模式SAM(C-SAM)检查的结果,证明了最佳的等离子清洗工艺会增强PBGA封装的定性等级,并提高工艺效率和生产率。
The optimization of process qualification have been established as follows : current of 92kA 、 aluminum level of 20-21 cm, the voltage of 4.188 V. Other process conditions are constant; Electrolysing cell run steadily and effect of decline energy consumption is obvious. 确立了优化的工艺条件为:92kA的电流强度下,铝水平保持20~21cm,槽电压为4.188伏,其它工艺条件基本不变,电解槽运行良好,降耗效果明显。